Tin Implanted Solder Ball Semiconductor High Temperature Welding 0.55mm Tin Grain Tin Ball

Name: Tin Implanted Solder Ball Semiconductor High Temperature Welding 0.55mm Tin Grain Tin Ball
Brand: DONG GUAN CITY YOSHIDA WELDING MATERIALS CO.,LTD
SKU: oZnaUyYbblGK
Price: 159.50 USD
Availability: InStock

Tin Implanted Solder Ball Semiconductor High Temperature Welding 0.55mm Tin Grain Tin Ball pictures & photos

Packing:	250K
Melting Point:	287°c
Application:	Chip/BGA Soldering
Composition:	Sn10pb90
Transport Package:	Carton+Foam Box
Specification:	0.55mm

Customization:	Available \| Customized Request

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