High Temperature Lead-Free Solder Ball Sn96.5AG3.5 BGA Tin Planting 0.5mm

Name: High Temperature Lead-Free Solder Ball Sn96.5AG3.5 BGA Tin Planting 0.5mm
Brand: DONG GUAN CITY YOSHIDA WELDING MATERIALS CO.,LTD
SKU: mJgYNUvcHHks
Price: 206.30 USD
Availability: InStock

High Temperature Lead-Free Solder Ball Sn96.5AG3.5 BGA Tin Planting 0.5mm pictures & photos

Packing:	250K
Melting Point:	217ºC
217ºC:	BGA Soldering
Composition:	Sn96.5AG3.5
Transport Package:	Carton+Foam Box
Specification:	10 bottles

Customization:	Available \| Customized Request

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