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Low Temperature Lead-Free Solder Ball Sn42bi57.6AG0.4 Tin Block Tin Planting 0.3mm pictures & photos
Low Temperature Lead-Free Solder Ball Sn42bi57.6AG0.4 Tin Block Tin Planting 0.3mm pictures & photos
Low Temperature Lead-Free Solder Ball Sn42bi57.6AG0.4 Tin Block Tin Planting 0.3mm pictures & photos
Low Temperature Lead-Free Solder Ball Sn42bi57.6AG0.4 Tin Block Tin Planting 0.3mm pictures & photos
Low Temperature Lead-Free Solder Ball Sn42bi57.6AG0.4 Tin Block Tin Planting 0.3mm pictures & photos
  • Low Temperature Lead-Free Solder Ball Sn42bi57.6AG0.4 Tin Block Tin Planting 0.3mm
  • Low Temperature Lead-Free Solder Ball Sn42bi57.6AG0.4 Tin Block Tin Planting 0.3mm
  • Low Temperature Lead-Free Solder Ball Sn42bi57.6AG0.4 Tin Block Tin Planting 0.3mm
  • Low Temperature Lead-Free Solder Ball Sn42bi57.6AG0.4 Tin Block Tin Planting 0.3mm
  • Low Temperature Lead-Free Solder Ball Sn42bi57.6AG0.4 Tin Block Tin Planting 0.3mm
Packing: 250K
Melting Point: 138ºC
Composition: Sn42bi57.6AG0.4
Application: BGA Soldering
Transport Package: Carton+Foam Box
Specification: 10 bottles
Customization:

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