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Tin-Lead Motherboard Chip Baseband Rework Tin Ball Tin Particles 0.76mm pictures & photos
Tin-Lead Motherboard Chip Baseband Rework Tin Ball Tin Particles 0.76mm pictures & photos
Tin-Lead Motherboard Chip Baseband Rework Tin Ball Tin Particles 0.76mm pictures & photos
Tin-Lead Motherboard Chip Baseband Rework Tin Ball Tin Particles 0.76mm pictures & photos
Tin-Lead Motherboard Chip Baseband Rework Tin Ball Tin Particles 0.76mm pictures & photos
Tin-Lead Motherboard Chip Baseband Rework Tin Ball Tin Particles 0.76mm pictures & photos
  • Tin-Lead Motherboard Chip Baseband Rework Tin Ball Tin Particles 0.76mm
  • Tin-Lead Motherboard Chip Baseband Rework Tin Ball Tin Particles 0.76mm
  • Tin-Lead Motherboard Chip Baseband Rework Tin Ball Tin Particles 0.76mm
  • Tin-Lead Motherboard Chip Baseband Rework Tin Ball Tin Particles 0.76mm
  • Tin-Lead Motherboard Chip Baseband Rework Tin Ball Tin Particles 0.76mm
  • Tin-Lead Motherboard Chip Baseband Rework Tin Ball Tin Particles 0.76mm
Packing: 250K
Melting Point: 287°c
Application: Chip/BGA Soldering
Composition: Sn10pb90
Transport Package: Carton+Foam Box
Specification: 0.76mm
Customization:

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