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Solder Paste Material for IC PCB BGA Cellphone Repairing pictures & photos
Solder Paste Material for IC PCB BGA Cellphone Repairing pictures & photos
Solder Paste Material for IC PCB BGA Cellphone Repairing pictures & photos
Solder Paste Material for IC PCB BGA Cellphone Repairing pictures & photos
Solder Paste Material for IC PCB BGA Cellphone Repairing pictures & photos
  • Solder Paste Material for IC PCB BGA Cellphone Repairing
  • Solder Paste Material for IC PCB BGA Cellphone Repairing
  • Solder Paste Material for IC PCB BGA Cellphone Repairing
  • Solder Paste Material for IC PCB BGA Cellphone Repairing
  • Solder Paste Material for IC PCB BGA Cellphone Repairing
Melting Point: 217ºC
Component: Sn96.5AG3cu0.5
Tin Powder Particles: T3/T4
Application: SMT
Weight: 500g
Cleaning Angle: No Cleaning
Customization:

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