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Tin Bismuth Silver Syringe Solder Paste Sn42bi57.6AG0.4 Yoshida pictures & photos
Tin Bismuth Silver Syringe Solder Paste Sn42bi57.6AG0.4 Yoshida pictures & photos
Tin Bismuth Silver Syringe Solder Paste Sn42bi57.6AG0.4 Yoshida pictures & photos
Tin Bismuth Silver Syringe Solder Paste Sn42bi57.6AG0.4 Yoshida pictures & photos
Tin Bismuth Silver Syringe Solder Paste Sn42bi57.6AG0.4 Yoshida pictures & photos
  • Tin Bismuth Silver Syringe Solder Paste Sn42bi57.6AG0.4 Yoshida
  • Tin Bismuth Silver Syringe Solder Paste Sn42bi57.6AG0.4 Yoshida
  • Tin Bismuth Silver Syringe Solder Paste Sn42bi57.6AG0.4 Yoshida
  • Tin Bismuth Silver Syringe Solder Paste Sn42bi57.6AG0.4 Yoshida
  • Tin Bismuth Silver Syringe Solder Paste Sn42bi57.6AG0.4 Yoshida
Melting Point: 138ºC
Composition: Sn42bi57.6AG0.4
Tin Powder Particles: T3/T4
Application Fields: SMT Spot Tin Process
Features: Smooth out Tin
Transport Package: Carton+Foam Box
Customization:

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