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Low Middle High Solder Past Mobile Phone Mainboard Soldering Flux for BGA

Name: Low Middle High Solder Past Mobile Phone Mainboard Soldering Flux for BGA
Brand: DONG GUAN CITY YOSHIDA WELDING MATERIALS CO.,LTD
SKU: RFntmwYvggfO
Price: 5.60 USD
Availability: InStock

Low Middle High Solder Past Mobile Phone Mainboard Soldering Flux for BGA pictures & photos

Tin Powder:	T3/T4
Melting Point:	183ºC
Element:	Sn63pb37
Application:	Repair
Cleaning Angle:	No Cleaning
Transport Package:	Carton+Foam Box

Customization:	Available \| Customized Request

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