Soldered at High Temperature with Lead Solder Ball Sn10pb88AG2 Tin Particles0.2mm0.3mm0.4mm0.5mm0.6mm0.76mm

Name: Soldered at High Temperature with Lead Solder Ball Sn10pb88AG2 Tin Particles0.2mm0.3mm0.4mm0.5mm0.6mm0.76mm
Brand: DONG GUAN CITY YOSHIDA WELDING MATERIALS CO.,LTD
SKU: NJFUTdHjLLhb
Price: 196.30 USD
Availability: InStock

Soldered at High Temperature with Lead Solder Ball Sn10pb88AG2 Tin Particles0.2mm0.3mm0.4mm0.5mm0.6mm0.76mm pictures & photos

Packing:	250K
Melting Point:	278°c
Application:	Chip/BGA Soldering
Composition:	Sn10pb88AG2
Transport Package:	Carton+Foam Box
Specification:	10 bottles

Customization:	Available \| Customized Request

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Soldered at High Temperature with Lead Solder Ball Sn10pb88AG2 Tin Particles0.2mm0.3mm0.4mm0.5mm0.6mm0.76mm

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