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High Temperature Lead-Free Solder Ball Tin Particles Sn96.5AG3cu0.5 BGA 0.6mm0.76mm pictures & photos
High Temperature Lead-Free Solder Ball Tin Particles Sn96.5AG3cu0.5 BGA 0.6mm0.76mm pictures & photos
High Temperature Lead-Free Solder Ball Tin Particles Sn96.5AG3cu0.5 BGA 0.6mm0.76mm pictures & photos
High Temperature Lead-Free Solder Ball Tin Particles Sn96.5AG3cu0.5 BGA 0.6mm0.76mm pictures & photos
High Temperature Lead-Free Solder Ball Tin Particles Sn96.5AG3cu0.5 BGA 0.6mm0.76mm pictures & photos
High Temperature Lead-Free Solder Ball Tin Particles Sn96.5AG3cu0.5 BGA 0.6mm0.76mm pictures & photos
  • High Temperature Lead-Free Solder Ball Tin Particles Sn96.5AG3cu0.5 BGA 0.6mm0.76mm
  • High Temperature Lead-Free Solder Ball Tin Particles Sn96.5AG3cu0.5 BGA 0.6mm0.76mm
  • High Temperature Lead-Free Solder Ball Tin Particles Sn96.5AG3cu0.5 BGA 0.6mm0.76mm
  • High Temperature Lead-Free Solder Ball Tin Particles Sn96.5AG3cu0.5 BGA 0.6mm0.76mm
  • High Temperature Lead-Free Solder Ball Tin Particles Sn96.5AG3cu0.5 BGA 0.6mm0.76mm
  • High Temperature Lead-Free Solder Ball Tin Particles Sn96.5AG3cu0.5 BGA 0.6mm0.76mm
Packing: 250K
Melting Point: 217°c
Application: BGA Soldering
Composition: Sn96.5AG3cu0.5
Transport Package: Carton+Foam Box
Specification: 250000PCS
Customization:

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