Mobile Phone Repair BGA Welding Lead-Free Solder Ball Sn96.5AG3cu0.5 Diameter 0.4mm

Name: Mobile Phone Repair BGA Welding Lead-Free Solder Ball Sn96.5AG3cu0.5 Diameter 0.4mm
Brand: DONG GUAN CITY YOSHIDA WELDING MATERIALS CO.,LTD
SKU: DmvpnoXxYIhB
Price: 16.60 USD
Availability: InStock

Mobile Phone Repair BGA Welding Lead-Free Solder Ball Sn96.5AG3cu0.5 Diameter 0.4mm pictures & photos

Melting Point:	217°c
Application:	Melting Point
Quantity:	250K
Composition:	Sn96.5AG3cu0.5
Transport Package:	Carton+Foam Box
Specification:	1pc

Customization:	Available \| Customized Request

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