Syringe Flux for Mobile Phone Repair and Welding

Product Description

Soldering flux is a paste-like soldering auxiliary material made by blending rosin with special chemical substances. It serves as an assisting agent in the soldering process and helps remove surface oxides from solder pads. It is commonly used in the soldering of BGA chips and is typically added as a necessary component during the production of solder paste. It is often used in conjunction with solder paste for post-soldering or touch-up soldering after surface mount assembly.

The main function of soldering flux is to remove surface oxides. Due to the presence of oxygen in the air, various materials are actually surrounded by a layer of oxide. During soldering, the oxide film will inevitably hinder the wetting of the solder to the base material, resulting in improper soldering. Therefore, soldering flux needs to be applied to the surface of the base material to reduce the oxide and eliminate the oxide film. On the other hand, the high temperature during soldering can easily cause oxidation on the surface of soldering materials, and soldering flux helps to inhibit this oxidation process.

Another function of soldering flux is to reduce surface tension on materials. The surface tension of a material can affect soldering quality. The use of soldering flux helps reduce the surface tension of the solder, enabling it to flow and wet the base material more effectively. When the flux covers the surface of the molten solder, it lowers the surface tension of the liquid solder, significantly improving its wetting properties."
 

Element	Fluorine(F)	Chlorine(CL)	Bromine(Br)	Lodine(L)	Application	Package
rosin	ND	ND	ND	ND	Repair/removal of surface oxides	100g/30g/10g

Non cleaning zero halogen lead-free solder paste has a very light residue color and a very high SIR value, which is very suitable for BGA, CSP and other ball array solder joint repair and ball repair.

It is applicable to the repair flux of SMD such as mobile phone PCB, BGA and PGA. It is used in the low ionic activator system. It has fast tin wetting speed, low smoke level, and high surface insulation impedance after the residue is solidified. Therefore, it has very little electrical interference to mobile phone and other communication products.

Dongguan YOSHIDA Welding Materials Co., Ltd. was established in 2003.  Company has 20 years of experience in the production and R&D of electronic welding materials, such as solder paste, solder paste, red glue, tin wire, tin bar, solder strip, solder ball, and solder strip
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FAQ
Q1: Are you Manufacturer or Trading company?
A: We are a manufacturer with 20 years experience in the production of welding wire, welding bar and solder paste.

Q2: How Do We Place An Order?
A:Please send Email or WeChat with us Via TM, MSN, Skype, and let us know your requirements on type, quantities.We will reply you with Proforma Invoice based on your order request. Kindly check the PI and If everything is OK,We will deliver  the goods  for you ASAP. After got your payment .

Q3. Do you accept  OEM orders?
A:Yes, of course. But we have quantity requirement, pls feel free to contact our salesman for details.

Q4: What is your advantage?
A: Manufacturers for better prices, good quality and reputation, professional sales services.

Q5: Can you offer the free sample for testing?
A: Yes,we can offer free sample for testing, but the freight cost should be paid by customer side. 

Q6. How to store and How long is the warranty period?
A:Stored in a cool, dry, non-corrosive environment. Product warranty period of 1 year. 

Q7. What is your terms of payment?
A: T/T 25% as deposit, and 75% before delivery. We'll show you the photos of the products and packages.

Q8. What about the delivery time?
A:Usually 1-2 days for samples and 3-5 days for bulk orders. 

Q9. Can we visit your company/factory before place the order?
A. Yes. Welcome anytime.