• 100*100mm Pure Indium Sheet Thermal Conductivity and Heat Dissipation Ultra-Low Temperature Sealing In100% Indium with Indium Foil Pure Indium Paper
  • 100*100mm Pure Indium Sheet Thermal Conductivity and Heat Dissipation Ultra-Low Temperature Sealing In100% Indium with Indium Foil Pure Indium Paper
  • 100*100mm Pure Indium Sheet Thermal Conductivity and Heat Dissipation Ultra-Low Temperature Sealing In100% Indium with Indium Foil Pure Indium Paper
  • 100*100mm Pure Indium Sheet Thermal Conductivity and Heat Dissipation Ultra-Low Temperature Sealing In100% Indium with Indium Foil Pure Indium Paper
  • 100*100mm Pure Indium Sheet Thermal Conductivity and Heat Dissipation Ultra-Low Temperature Sealing In100% Indium with Indium Foil Pure Indium Paper
  • 100*100mm Pure Indium Sheet Thermal Conductivity and Heat Dissipation Ultra-Low Temperature Sealing In100% Indium with Indium Foil Pure Indium Paper

100*100mm Pure Indium Sheet Thermal Conductivity and Heat Dissipation Ultra-Low Temperature Sealing In100% Indium with Indium Foil Pure Indium Paper

Component: In100
Melting Point: 157ºC
Application: Low Temperature Welding
Specifications: OEM
Transport Package: Carton+Foam Box
Specification: 100*100*0.05
Customization:
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Manufacturer/Factory

Basic Info.

Model NO.
In100
Trademark
YOSHIDA
Origin
China

Product Description

Tape and Reel Preforms provide an easy way to increase the amount of solder for assembly applications using solder paste. These rectangular solder tabs do not contain flux, but can be reflowed with flux in the solder paste. Simply place rectangular solder tabs into the solder paste to precisely increase the amount of solder. The entire line of tape-and-reel rectangular solder lugs can be placed in standard placement equipment, utilizing industry standard placement processes. A variety of solder volumes are available, providing maximum flexibility and cost-effectiveness, as a single solder preform can add precisely the amount of solder required.
 
Features: 0402/0603/0805/0202/0201 size rectangular solder tabs, as well as many other sizes of preformed solder tabs, can be used with solder paste. Flux-free, but can rely on flux in the solder paste for reflow. Alloys are highly flexible, including general lead-free and lead-containing alloys for printed circuit board packaging. Available for half-height solder tabs - 0402H, 0603 and 0805 - ideal for ground-supported connectors. Quick placement with standard equipment Available in 7" and 13" IEC reel packaging advantage: Shorten time-to-market and eliminates solder shortages without changing PCB design Precisely increase solder volume Perfect for through-hole soldering applications, as well as eliminating wave soldering Reduces flux/paste ratio in standard solder pastes, thereby reducing flux residues Reduces the need for overprinting of solder paste, thereby reducing flux and solder beading Eliminate the use of stepped stencils Compatible with standard SMD component database Compatible with standard pick and place nozzles Available in all standard solder pastes combined application: Placing TONG FANG tape-and-reel preformed solder sheets in the solder paste can precisely increase the amount of solder. Only a portion of the preformed solder sheet is in contact with the solder paste, which greatly increases the flexibility of the operation. Lead-free solder preforms must not be less than 25% in contact with solder paste, and lead-containing preforms must not be less than 10% in contact with solder paste. In air reflow, solder preforms can increase the solder volume by a factor of 4 without overly diluting the flux. It can be increased by a factor of 10 under nitrogen reflux.
100*100mm Pure Indium Sheet Thermal Conductivity and Heat Dissipation Ultra-Low Temperature Sealing In100% Indium with Indium Foil Pure Indium Paper

 

Size

Dimensions

Volume

Dimensions

Volume

 

a

b

a

 

a

b

c

 

inch

mm

mm

mm3

mil

mil3

0201

0503

0.47

0.28

0.28

0.037

18.5

11.0

11.0

2.249

0202

0505

0.51

0.51

0.25

0.065

20.1

20.1

9.8

3.968

03015S

06035

0.60

0.35

0.35

0.074

23.6

13.8

13.8

4.485

0402H

1006

1.00

0.60

0.25

0.150

39.4

23.6

9.8

9.154

0402

1005

1.00

0.5

0.5

0.25

39.4

19.7

19.7

15.256

0402B

10055

1.00

0.55

0.55

0.303

39.4

21.7

21.7

18.46

0603H

1608H

1.60

0.80

0.50

0.640

63.0

31.5

19.7

39.055

0603

1608

1.60

0.80

0.80

1.024

63.0

31.5

31.5

62.488

0805H

2013H

2.01

1.3

0.40

1.045

79.1

51.2

15.7

63.782

0805

2013

2.01

1.30

0.76

1.986

79.1

51.2

29.9

121.186

0805S

2013S

2.01

1.30

1.30

3.397

79.1

51.2

51.2

207.292

1206

3015

3.00

1.47

0.77

3.396

118.1

57.9

30.3

207.218

1306

3216

3.20

1.60

0.80

4.096

126.0

63.0

31.5

249.953

1406

3515

3.56

1.52

0.77

4.167

140.2

59.8

30.3

254.263

Dongguan YOSHIDA Welding Materials Co., Ltd. was established in 2003.  Company has 20 years of experience in the production and R&D of electronic welding materials, such as solder paste, solder paste, red glue, tin wire, tin bar, solder strip, solder ball, and solder strip100*100mm Pure Indium Sheet Thermal Conductivity and Heat Dissipation Ultra-Low Temperature Sealing In100% Indium with Indium Foil Pure Indium Paper100*100mm Pure Indium Sheet Thermal Conductivity and Heat Dissipation Ultra-Low Temperature Sealing In100% Indium with Indium Foil Pure Indium Paper100*100mm Pure Indium Sheet Thermal Conductivity and Heat Dissipation Ultra-Low Temperature Sealing In100% Indium with Indium Foil Pure Indium PaperInternal display
100*100mm Pure Indium Sheet Thermal Conductivity and Heat Dissipation Ultra-Low Temperature Sealing In100% Indium with Indium Foil Pure Indium Paper100*100mm Pure Indium Sheet Thermal Conductivity and Heat Dissipation Ultra-Low Temperature Sealing In100% Indium with Indium Foil Pure Indium Paper100*100mm Pure Indium Sheet Thermal Conductivity and Heat Dissipation Ultra-Low Temperature Sealing In100% Indium with Indium Foil Pure Indium Paper100*100mm Pure Indium Sheet Thermal Conductivity and Heat Dissipation Ultra-Low Temperature Sealing In100% Indium with Indium Foil Pure Indium Paper100*100mm Pure Indium Sheet Thermal Conductivity and Heat Dissipation Ultra-Low Temperature Sealing In100% Indium with Indium Foil Pure Indium Paper100*100mm Pure Indium Sheet Thermal Conductivity and Heat Dissipation Ultra-Low Temperature Sealing In100% Indium with Indium Foil Pure Indium Paper
FAQ
Q1: Are you Manufacturer or Trading company?
A: We are a manufacturer with 20 years experience in the production of welding wire, welding bar and solder paste.

Q2: How Do We Place An Order?
A:Please send Email or WeChat with us Via TM, MSN, Skype, and let us know your requirements on type, quantities.We will reply you with Proforma Invoice based on your order request. Kindly check the PI and If everything is OK,We will deliver  the goods  for you ASAP. After got your payment .

Q3. Do you accept  OEM orders?
A:Yes, of course. But we have quantity requirement, pls feel free to contact our salesman for details.

Q4: What is your advantage?
A: Manufacturers for better prices, good quality and reputation, professional sales services.

Q5: Can you offer the free sample for testing?
A: Yes,we can offer free sample for testing, but the freight cost should be paid by customer side. 

Q6. How to store and How long is the warranty period?
A:Stored in a cool, dry, non-corrosive environment. Product warranty period of 1 year. 

Q7. What is your terms of payment?
A: T/T 25% as deposit, and 75% before delivery. We'll show you the photos of the products and packages.

Q8. What about the delivery time?
A:Usually 1-2 days for samples and 3-5 days for bulk orders. 

Q9. Can we visit your company/factory before place the order?
A. Yes. Welcome anytime.

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